The K series industrial endoscope from VSNDT has demonstrated its unique technical advantages and practical application value in the process of assisting well-known automobile manufacturers in inspecting automobile brake system assembly circuit boards. The following is an analysis from three aspects: technical adaptability, matching of inspection requirements, and actual results:
High-resolution imaging system
Mega-pixel: The K series is equipped with a ≥1MP high-definition camera, which can clearly present details such as the quality of circuit board solder joints and the status of components, and is especially suitable for detecting defects such as tiny cracks and cold solder joints.
Dual camera collaboration: Some models (such as KS6010J) support direct view and side view dual lens switching to achieve all-round detection without dead angles, covering complex circuit board layouts.
Flexible operation and precise guidance
360° articulation head: The lens can freely adjust the angle to adapt to the dense arrangement of components on the circuit board and accurately locate the inspection area.
Portable design: The body is light (such as WS-K6010H weighs only a few hundred grams), ergonomic, and easy to operate for a long time in a narrow space.
Environmental adaptability and stability
IP67 protection level: The probe is waterproof, oil-proof, and corrosion-resistant, and can operate stably in the complex environment inside the brake system assembly (such as lubricating oil and metal debris).
Ultra-long battery life and storage: The built-in lithium battery supports ≥4 hours of continuous operation, and the 32G storage space meets the needs of recording large amounts of test data.
High-precision defect detection needs
Solder point quality inspection: Identify welding defects such as cold solder joints and cold solder joints to ensure the reliability of electrical connections on circuit boards.
Component status assessment: Detect whether components such as capacitors and resistors are loose or falling off to prevent short circuit risks.
Challenges for complex structure detection
Multi-layer circuit board detection: Support non-destructive testing of the inner layer routing and via quality of multi-layer PCBs to avoid damage to components caused by traditional X-ray detection.
Accessibility in small spaces: Ultra-fine probes (diameter 1.2-6mm) can penetrate into difficult-to-reach areas such as circuit board gaps and connectors.
Optimization of efficient detection processes
Quickly locate problems: Combined with real-time image transmission function, inspectors can analyze defects instantly and shorten diagnosis time.
Data digital management: Support image/video recording and report generation to facilitate quality traceability and process improvement.
Improved detection efficiency
Non-disassembly detection: Internal detection can be performed without disassembling the brake system assembly, reducing downtime by about 60%.
Quick screening: The single detection cycle is shortened from 2-3 hours in traditional methods to within 30 minutes.
Improved defect detection rate
Early fault warning: Through regular endoscopic inspection, a well-known automobile manufacturer successfully increased the circuit board defect detection rate from 75% to 92%, significantly reducing the cost of rework.
Typical case: A batch of circuit boards was found to have multiple solder joint cracking hazards, and timely replacement was carried out to avoid potential brake failure risks.
Process improvement support
Design optimization: Based on the feedback from the test data, the manufacturer adjusted the circuit board layout, reduced the density of components, and improved the heat dissipation performance.
Supply chain control: Conduct special audits on suppliers of high-frequency defective components to promote overall quality improvement.
VSNDT K series industrial endoscopes, with their technical advantages such as high-resolution imaging, flexible operation, and environmental adaptability, perfectly match the high-precision, high-efficiency, and non-destructive testing needs of well-known automobile manufacturers for brake system assembly circuit boards. Its application not only improves the inspection efficiency and defect detection rate, but also provides data support for process improvement and supply chain management for automobile manufacturers, becoming a key technical tool to ensure automobile safety performance.
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